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5DD.SI - Micro-Mechanics (Hol...

Financial Summary of Micro-Mechanics (Holdings) Ltd.(5DD.SI), Micro-Mechanics (Holdings) Ltd. designs, manufactures, and markets high precision parts and tools us

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Micro-Mechanics (Holdings) Ltd.

5DD.SI

SES

Micro-Mechanics (Holdings) Ltd. designs, manufactures, and markets high precision parts and tools used in applications for the wafer-fabrication and assembly processes of the semiconductor industry. It operates through five segments: Singapore, Malaysia, The Philippines, USA, and China. The company offers die attach - pick-up products, such as rubber tips, high-temp plastic tools, tungsten carbide tools, sensor assemblies, and vacuum wand tools; die attach - dispensing products, including dispense nozzle adaptors, dispense nozzles, pen dispense assemblies, writing pen nozzle tips, and epoxy stamping tools; and die attach - die ejection products comprising ejector needles, needle holders/pepper pots, and needle holder seals. It also provides thermosonic bonding products that include clamps and electronic flame off products; ultrasonic bonding products comprising clamps, bearing base assemblies, anvils, and wire cutters; and encapsulation products consisting of BGA dispensing nozzles, dispensing manifolds, pump screws, and O-rings. In addition, the company manufactures precision parts and assemblies on a contract basis for OEMs. Micro-Mechanics (Holdings) Ltd. was founded in 1983 and is based in Singapore.

1.44 SGD

-0.01 (-0.694%)

About

ceo

Mr. Christopher Reid Borch

sector

Technology

industry

Semiconductors

website

https://www.micro-mechanics.com

exchange

SES

Description

Micro-Mechanics (Holdings) Ltd. designs, manufactures, and markets high precision parts and tools used in applications for the wafer-fabrication and assembly processes of the semiconductor industry. It operates through five segments: Singapore, Malaysia, The Philippines, USA, and China. The company offers die attach - pick-up products, such as rubber tips, high-temp plastic tools, tungsten carbide tools, sensor assemblies, and vacuum wand tools; die attach - dispensing products, including dispense nozzle adaptors, dispense nozzles, pen dispense assemblies, writing pen nozzle tips, and epoxy stamping tools; and die attach - die ejection products comprising ejector needles, needle holders/pepp...

CIK

N/A

ISIN

SG1O09910991

CUSIP

N/A

Address

No. 31 Kaki Bukit Place

Phone

65 6746 8800

Country

SG

Employee

495

IPO Date

Jun 25, 2003

Summary

CIK

-

Exchange

SES

Industry

Semiconductors

Sector

Technology

CUSIP

-

ISIN

SG1O09910991

Country

SG

Price

1.44

Beta

0.28

Volume Avg.

43.41k

Market Cap

200.21M

Shares

-

52-Week

1.37-2.12

DCF

3.32

ROE

-

ROA

-

Operating Margin

-

Debt/Equity

-

P/E

24

P/B

-

Website

https://www.micro-mechanics.com

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