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IMOS - ChipMOS TECHNOLOGIES...

Financial Summary of ChipMOS TECHNOLOGIES INC.(IMOS), ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integr

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ChipMOS TECHNOLOGIES INC.

IMOS

NASDAQ

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.

29.13 USD

-0.72 (-2.47%)

About

ceo

Mr. Shih-Jye Cheng

sector

Technology

industry

Semiconductors

website

https://www.chipmos.com

exchange

NASDAQ

Description

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mix...

CIK

0001123134

ISIN

US16965P2020

CUSIP

16965P103

Address

No. 1, R&D Road 1

Phone

886 3 577 0055

Country

TW

Employee

5,688

IPO Date

Jul 3, 2003

Summary

CIK

0001123134

Exchange

NASDAQ

Industry

Semiconductors

Sector

Technology

CUSIP

16965P103

ISIN

US16965P2020

Country

TW

Price

29.13

Beta

0.54

Volume Avg.

26.03k

Market Cap

1.06B

Shares

-

52-Week

21.58-32.19

DCF

0.58

ROE

-

ROA

-

Operating Margin

-

Debt/Equity

-

P/E

17.44

P/B

-

Website

https://www.chipmos.com

Historical Prices

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Financial Statement

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Earnings

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Upgrades and Downgrades

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