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P4O.DE - Plan Optik AG

Profile of Plan Optik AG(P4O.DE), Plan Optik AG manufactures and sells structured wafers in Germany. The company offers substrate wafe

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Plan Optik AG

P4O.DE

XETRA

Plan Optik AG manufactures and sells structured wafers in Germany. The company offers substrate wafers comprising borosilicate, quartz, fused silica, alkaline free, and silicon-on-glass wafers; carriers and tools, such as chemical release, thermal release, laser release, and mechanical release carrier wafers, as well as adapter wafer and handling tools; packaging wafers, including through hole wafers, cavity wafers, trenched wafers, customized cap solutions, and wafers with structured SI-layers. It also provides interposers, which include glass interposers, SI interposers, through glass vias, and redistribution layers; and microfluidics, including micro reactors, fluidic chips, flow chemistry sets, and sensors, as well as services, such as mechanical processing, patterning, wafer thinning, coating, wire sawing, and bonding services. It serves consumer electronics, automotive, aerospace, chemistry, and pharmaceutical industries. The company is headquartered in Elsoff, Germany.

4.16 EUR

0.02 (0.481%)

About

ceo

Mr. Michael Schilling

sector

Technology

industry

Hardware, Equipment & Parts

exchange

XETRA

Description

Plan Optik AG manufactures and sells structured wafers in Germany. The company offers substrate wafers comprising borosilicate, quartz, fused silica, alkaline free, and silicon-on-glass wafers; carriers and tools, such as chemical release, thermal release, laser release, and mechanical release carrier wafers, as well as adapter wafer and handling tools; packaging wafers, including through hole wafers, cavity wafers, trenched wafers, customized cap solutions, and wafers with structured SI-layers. It also provides interposers, which include glass interposers, SI interposers, through glass vias, and redistribution layers; and microfluidics, including micro reactors, fluidic chips, flow chemistry sets, and sensors, as well as services, such as mechanical processing, patterning, wafer thinning, coating, wire sawing, and bonding services. It serves consumer electronics, automotive, aerospace, chemistry, and pharmaceutical industries. The company is headquartered in Elsoff, Germany.

CIK

N/A

ISIN

DE000A0HGQS8

CUSIP

D6132C107

Address

Ueber der Bitz 3

Phone

49 2664 5068 0

Country

DE

Employee

107

IPO Date

Dec 29, 2005

Key Executives

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